Center for Quantum Devices - Facilities and Equipment

Watch a 15-minute video tour of the CQD's facilites.
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Entrance to the CQD Cleanroom This is the main airlock granting entrance to the CQD's cleanroom facilities. Notice the hazardous gas detection annunciators above the door.	Emcore MOCVD Reactor Commercial Emcore shower head reactor used primarily for the growth of quantum dots.
Emcore MOCVD Reactor Close up of Emcore reactor growth chamber.	Gas Source MBE reactor Gas Source Molecular Beam Epitaxy system used in the growth of Quantum Cascade Lasers.
Solid-Source MBE Reactor This is the Solid Source MBE reactor used in the growth of Type-II superlattice photodetectors.	Aixtron MOCVD Reactor Commercial Horizontal flow Aixtron MOCVD reactor. One of the first ever developed to facilitate the growth of III-Nitirdes
EFEREL MOCVD Reactor Commercial horizontal-flow low-pressure MOCVD reactor designed by Professor Razeghi in conjunction with French company EFEREL. This reactor is used to grow QWIPs, QDWIPs, and other quantum dot materials.	Infrared Detector Characterization Setup Cryostat, blackbody, and lock-in amplifier used in the testing of IR detectors.
Infrared Laser Characterization Setup One of the setup used in the Characterization of Quantum Cascade Lasers	UV Device Characterization Setup This is the measurement setup used to characterize UV lasers, LEDs, photodetectors, and APDs.
Electron Beam Lithography Lica Lion-LV1 electron beam lithography system capable or producing features smaller than 30 nm.	Laser Measurement Setup Bruker FRIR, laser drivers, thermostatic stage, and data acquisition equipment
Photodetector Measurment Setup Burker FTIR and Helium cryostat used to characterize Infrared materials and devices.	Lapping & Polishing One of two Logitech lapping and polsihing systems used to mechanically thin laser diodes in preperatiion for cleaving, or to assist in back-thinning of hybridized focal plane arrays for higher performance.
Laser Bonder SET FC-150 high-precision die-bonder used to bond lasers with excellent placement accuracy and planarity.	Atomic Force Microscope Digital Instruments, Nanoscope D3100 scanning probe microscope in a vibration isolation enclosure, configured for tapping more AFM.
IR Photoluminescence Setup used to characterize IR material using an argon-ion laser, monochromator, lock-in amplifier, and various commercial IR detectors.	Scanning Electron Microscope Hitachi 4500 cold field emission SEM used in the characterization of epitaxial films and the processing of semiconductor devices.
High-Resolution X-Ray Diffraction System $High-Resolution X-Ray Diffraction System$ Philips HR-XRD with a 2 KW copper Kα source, 4-bounce germanium monochromator, precision goniometer, and scintillation detector.	Chemistry Room Class 1000 chemistry room with four hoods, mask aligner, and yellow lighting to support lithography and semiconductor device processing.
Wire Bonder Gold wire bonder used in the packaging of semiconductor devices for test.	Inductively Coupled Plasma (ICP) Ethcing system Inductively coupled plasma (ICP) ethcing system used to etch high aspect ratio features in semiconductors.
X-ray Difractometer $X-ray Difractometer$ BEDE D1 High resolution X-ray difractometer equipped with an analyzer crystal for reciprocal space mapping. This maching can also perform spatial matting of up to 4-inch wafers	Optical Profiler Zygo NewView optical profiler used to create 3D surface maps of wafers
Metal E-beam Evaporator Electron-beam metal deposition system outfitted for deposition of Gold, Platinum, Titanium, and Nickel, with a secondary thermal boat for evaporation of Gold-Germanium.

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