Center for Quantum Devices - Facilities and Equipment

Watch a 15-minute video tour of the CQD's facilites.
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ECR Etching System PlasmaLabs Electron Cyclotron Resonance dry etching system used in the processing of semiconductor devices	PECVD System Oxford Instrument Plasma Enhanced Chemical Vapor Deposition system used to deposit dielectrics such as silicon dioxide and silicon nitride used in the passivation of devices.
Thermal Evaporator This is an extensively modified Veeco thermal evaporator that is used to deposit metals.	Electric Capacitance-Voltage Profiler Accent Optical ECV-Pro Capacitance-Voltage profiling machine (also known as Polaron) used to charicterize the doping profile.
Hydrogen Generator Electrolysis module used to dynamically generate all of the hydrogen used in the cleanroom facility.	UV Photoluminescence Three UV lasers (193 nm Excimer, 244 nm Fred Argon-Ion, and 325 nm HeCd), monochromatoer, electronics, and computer system used to charicterize III-Nitride materials.
UV Device Charicterization Probe-station and electronics used to characterize APDs, LEDs, and other uncooled III-Nitride devices.	Dicing System This K&S 7100 semi-automatic dicing system is used in the partition of wafers into smaller die.
Life testing System Life testing system allows for extended logging and testing of lasers and LEDs at controlled currents, voltages, or output powers, at a constant temperature.	Scribing Machine Lomis scribe and break machine used to cleave wafers.
Camera System Electronics head and LN2 Dewar of the SE-IR camera system used to operate FPAs and perform array characterization.	EDX Hitachi S4500 Cold field emission scanning electron microscope (SEM) with an Oxford EDX detector for elemental analysis.
SE-IR Camera System New SE-IR camera system used to operate large format and two-color FPAs with lower noise and higher frame rates.	Wire Bonder SUSS wire bonder used to perform gold wedge and ball bonding in order to make electrical contact to discreet devices.
MOCVD Reactor This is the MOCVD reactor developed by Professor Razerghi at Thompson and brought with her to northwestern.	Toxic Gas Detection System This is the MDA toxic gas detection system that helps ensure the safety of the labs and surrounding area.
SEC Die Bonder Die Bonder used to fabricate laser diodes and back emission LEDs.	Dielectric Evaporator CHA E-Beam Evaporator designed to evaporate various dielectrics. Has built in optical monitor to assist in fabrication of mirror and AR coatings.
FPA Hybridization Bonder SET FC-150 high precision high force bonder used to hybridize focal plane arrays.	High-Resistance Hall Mesurment System Custom high-resistance Hall measurement system based on electronics from Keithely, and a magnet from BioRad.
Ion-Beam deposition system Dual-beam ion-beam deposition system used to deposit high quality dielectric films at low temperatures.	Bulk Storage LN2 tank Bulk liquid nitrogen (LN2) storage tank used to supply LN2 for the MBE reactors, cryostats, and various other needs.
THz Optical Setup Black body source, Liquid helium cryostat, optical mounts, optics, and beam purge tubes to allow for measurement of terahertz (THz) devices.	Machinging various mechanical support equipment to allow for rapid prototyping and repair. Includes: Drill press, grinder, Sherline CNC mill and lathe, and metal cutting band-saw.
Mask Aligner Karl Suss MA-6 high precision mask aligner used to perform photolithography.

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