Wire Bonder
![Wire Bonder](about/facilities/wirebonder.jpg) Gold wire bonder used in the packaging of semiconductor devices for test. |
Inductively Coupled Plasma (ICP) Ethcing system
![Inductively Coupled Plasma (ICP) Ethcing system](about/facilities/ICP-Etching.jpg) Inductively coupled plasma (ICP) ethcing system used to etch high aspect ratio features in semiconductors. |
X-ray Difractometer
![X-ray Difractometer](about/facilities/X-Ray_Difractometer.jpg) BEDE D1 High resolution X-ray difractometer equipped with an analyzer crystal for reciprocal space mapping. This maching can also perform spatial matting of up to 4-inch wafers |
Optical Profiler
![Optical Profiler](about/facilities/Optical_Profiler.jpg) Zygo NewView optical profiler used to create 3D surface maps of wafers |
Metal E-beam Evaporator
![Metal E-beam Evaporator](about/facilities/ebeam.jpg) Electron-beam metal deposition system outfitted for deposition of Gold, Platinum, Titanium, and Nickel, with a secondary thermal boat for evaporation of Gold-Germanium. |
ECR Etching System
![ECR Etching System](about/facilities/ecr.jpg) PlasmaLabs Electron Cyclotron Resonance dry etching system used in the processing of semiconductor devices |
PECVD System
![PECVD System](about/facilities/pecvd.jpg) Oxford Instrument Plasma Enhanced Chemical Vapor Deposition system used to deposit dielectrics such as silicon dioxide and silicon nitride used in the passivation of devices. |
Thermal Evaporator
![Thermal Evaporator](about/facilities/thermal_Evaporator.jpg) This is an extensively modified Veeco thermal evaporator that is used to deposit metals. |
Electric Capacitance-Voltage Profiler
![Electric Capacitance-Voltage Profiler](about/facilities/ECV-Pro.jpg) Accent Optical ECV-Pro Capacitance-Voltage profiling machine (also known as Polaron) used to charicterize the doping profile. |
Hydrogen Generator
![Hydrogen Generator](about/facilities/Hydrogen-Generator.jpg) Electrolysis module used to dynamically generate all of the hydrogen used in the cleanroom facility. |