UV Photoluminescence
![UV Photoluminescence](about/facilities/UV-PL.jpg) Three UV lasers (193 nm Excimer, 244 nm Fred Argon-Ion, and 325 nm HeCd), monochromatoer, electronics, and computer system used to charicterize III-Nitride materials. |
UV Device Charicterization
![UV Device Charicterization](about/facilities/UV-Meas.jpg) Probe-station and electronics used to characterize APDs, LEDs, and other uncooled III-Nitride devices. |
Dicing System
![Dicing System](about/facilities/Dicer.jpg) This K&S 7100 semi-automatic dicing system is used in the partition of wafers into smaller die. |
Life testing System
![Life testing System](about/facilities/LifeTester.jpg) Life testing system allows for extended logging and testing of lasers and LEDs at controlled currents, voltages, or output powers, at a constant temperature. |
Scribing Machine
![Scribing Machine](about/facilities/Scribe&Break.jpg) Lomis scribe and break machine used to cleave wafers. |
Camera System
![Camera System](about/facilities/SE-IR_Camera_System.jpg) Electronics head and LN2 Dewar of the SE-IR camera system used to operate FPAs and perform array characterization. |
EDX
![EDX](about/facilities/SEM-EDX.jpg) Hitachi S4500 Cold field emission scanning electron microscope (SEM) with an Oxford EDX detector for elemental analysis. |
SE-IR Camera System
![SE-IR Camera System](about/facilities/SEIR_Camera.jpg) New SE-IR camera system used to operate large format and two-color FPAs with lower noise and higher frame rates. |
Wire Bonder
![Wire Bonder](about/facilities/WireBonder2.jpg) SUSS wire bonder used to perform gold wedge and ball bonding in order to make electrical contact to discreet devices. |
MOCVD Reactor
![MOCVD Reactor](about/facilities/MOCVD2-1.jpg) This is the MOCVD reactor developed by Professor Razerghi at Thompson and brought with her to northwestern. |