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Publications by all authors title journal keywords summary date     Page 1  (16 Items) 1.   High Performance Solar-Blind Ultraviolet Focal Plane Arrays Based on AlGaN Erdem Cicek, Ryan McClintock, Abbas Haddadi, William A. Gaviria Rojas, and Manijeh Razeghi IEEE Journal of Quantum Electronics, Vol. 50, Issue 8, p 591-595-- August 1, 2014 We report on solar-blind ultraviolet, AlxGa1-x N- based,p-i-n,focal plane array (FPA) with 92% operability. At the peak detection wavelength of 278 nm, 320×256-FP A-pixel showed unbiased peak external quantum efficiency (EQE) and responsivity of 49% and 109 mA/W, respectively, increasing to 66% under 5 volts of reverse bias. Electrical measurements yielded a low-dark current density: <7×10-9A/cm², at FPA operating voltage of 2 volts of reverse bias. reprint   2.   AlxGa1-xN-based back-illuminated solar-blind photodetectors with external quantum efficiency of 89% E. Cicek, R. McClintock, C. Y. Cho, B. Rahnema, and M. Razeghi Appl. Phys. Lett. 103, 191108 (2013)-- November 5, 2013 We report on high performance AlxGa1−xN-based solar-blind ultraviolet photodetector (PD) array grown on sapphire substrate. First, high quality, crack-free AlN template layer is grown via metalorganic chemical vapor deposition. Then, we systematically optimized the device design and material doping through the growth and processing of multiple devices. After optimization, uniform and solar-blind operation is observed throughout the array; at the peak detection wavelength of 275 nm, 729 μm² area PD showed unbiased peak external quantum efficiency and responsivity of ∼80% and ∼176 mA/W, respectively, increasing to 89% under 5 V of reverse bias. Taking the reflection loses into consideration, the internal quantum efficiency of these optimized PD can be estimated to be as high as ∼98%. The visible rejection ratio measured to be more than six orders of magnitude. Electrical measurements yielded a low-dark current density: <2 × 10−9 A/cm², at 10 V of reverse bias. reprint   3.   AlxGa1−xN-based solar-blind ultraviolet photodetector based on lateral epitaxial overgrowth of AlN on Si substrate E. Cicek, R. McClintock, C. Y. Cho, B. Rahnema, and M. Razeghi Appl. Phys. Lett. 103, 181113 (2013)-- October 30, 2013 We report on AlxGa1−xN-based solar-blind ultraviolet (UV) photodetector (PD) grown on Si(111) substrate. First, Si(111) substrate is patterned, and then metalorganic chemical vapor deposition is implemented for a fully-coalesced ∼8.5 μm AlN template layer via a pulsed atomic layer epitaxial growth technique. A back-illuminated p-i-n PD structure is subsequently grown on the high quality AlN template layer. After processing and implementation of Si(111) substrate removal, the optical and electrical characteristic of PDs are studied. Solar-blind operation is observed throughout the array; at the peak detection wavelength of 290 nm, 625 μm² area PD showed unbiased peak external quantum efficiency and responsivity of ∼7% and 18.3 mA/W, respectively, with a UV and visible rejection ratio of more than three orders of magnitude. Electrical measurements yielded a low-dark current density below 1.6 × 10−8 A/cm² at 10 V reverse bias. reprint   4.   Surface plasmon enhanced light emission from AlGaN-based ultraviolet light-emitting diodes grown on Si (111) Chu-Young Cho, Yinjun Zhang, Erdem Cicek, Benjamin Rahnema, Yanbo Bai, Ryan McClintock, and Manijeh Razeghi Appl. Phys. Lett. 102, 211110 (2013)-- May 31, 2013 We report on the development of surface plasmon (SP) enhanced AlGaN-based multiple quantum wells (MQWs) ultraviolet (UV) light-emitting diodes (LEDs) grown on silicon (111) substrates. In order to generate SP-coupling with the radiating dipoles in MQWs, an aluminum layer is selectively deposited in holes etched in the top p-AlGaN to p-GaN layers. After flip-chip bonding and substrate removal, an optical output power of ∼1.2 mW is achieved at an emission wavelength of 346 nm; the output power of these UV LEDs with Al layer is increased by 45% compared to that of conventional UV LEDs without Al layer. This enhancement can be attributed to an increase in the spontaneous emission rate and improved internal quantum efficiency via resonance coupling between excitons in MQWs and SPs in the aluminum layer. reprint   5.   Engineering future light emitting diodes and photovoltaics with inexpensive materials: Integrating ZnO and Si into GaN-based devices C. Bayram ; K. T. Shiu ; Y. Zhu ; C. W. Cheng ; D. K. Sadana ; F. H. Teherani ; D. J. Rogers ; V. E. Sandana ; P. Bove ; Y. Zhang ; S. Gautier ; C.-Y. Cho ; E. Cicek ; Z. Vashaei ; R. McClintock ; M. Razeghi Proc. SPIE 8626, Oxide-based Materials and Devices IV, 86260L (March 18, 2013)-- March 18, 2013 Indium Gallium Nitride (InGaN) based PV have the best fit to the solar spectrum of any alloy system and emerging LED lighting based on InGaN technology and has the potential to reduce energy consumption by nearly one half while enabling significant carbon emission reduction. However, getting the maximum benefit from GaN diode -based PV and LEDs will require wide-scale adoption. A key bottleneck for this is the device cost, which is currently dominated by the substrate (i.e. sapphire) and the epitaxy (i.e. GaN). This work investigates two schemes for reducing such costs. First, we investigated the integration of Zinc Oxide (ZnO) in InGaN-based diodes. (Successful growth of GaN on ZnO template layers (on sapphire) was illustrated. These templates can then be used as sacrificial release layers for chemical lift-off. Such an approach provides an alternative to laser lift-off for the transfer of GaN to substrates with a superior cost-performance profile, plus an added advantage of reclaiming the expensive single-crystal sapphire. It was also illustrated that substitution of low temperature n-type ZnO for n-GaN layers can combat indium leakage from InGaN quantum well active layers in inverted p-n junction structures. The ZnO overlayers can also double as transparent contacts with a nanostructured surface which enhances light in/out coupling. Thus ZnO was confirmed to be an effective GaN substitute which offers added flexibility in device design and can be used in order to simultaneously reduce the epitaxial cost and boost the device performance. Second, we investigated the use of GaN templates on patterned Silicon (100) substrates for reduced substrate cost LED applications. Controlled local metal organic chemical vapor deposition epitaxy of cubic phase GaN with on-axis Si(100) substrates was illustrated. Scanning electron microscopy and transmission electron microscopy techniques were used to investigate uniformity and examine the defect structure in the GaN. Our results suggest that groove structures are very promising for controlled local epitaxy of cubic phase GaN. Overall, it is concluded that there are significant opportunities for cost reduction in novel hybrid diodes based on ZnO-InGaN-Si hybridization. reprint   6.   Crack-free AlGaN for solar-blind focal plane arrays through reduced area expitaxy E. Cicek, R. McClintock, Z. Vashaei, Y. Zhang, S. Gautier, C.Y. Cho and M. Razeghi Applied Physics Letters, Vol. 102, No. 05, p. 051102-1-- February 4, 2013 We report on crack reduction for solar-blind ultraviolet detectors via the use of a reduced area epitaxy (RAE) method to regrow on patterned AlN templates. With the RAE method, a pre-deposited AlN template is patterned into isolated mesas in order to reduce the formation of cracks in the subsequently grown high Al-content AlxGa1−xN structure. By restricting the lateral dimensions of the epitaxial growth area, the biaxial strain is relaxed by the edges of the patterned squares, which resulted in ∼97% of the pixels being crack-free. After successful implementation of RAE method, we studied the optical characteristics, the external quantum efficiency, and responsivity of average pixel-sized detectors of the patterned sample increased from 38% and 86.2 mA/W to 57% and 129.4 mA/W, respectively, as the reverse bias is increased from 0 V to 5 V. Finally, we discussed the possibility of extending this approach for focal plane array, where crack-free large area material is necessary for high quality imaging. reprint   7.   Gallium nitride on silicon for consumer & scalable photonics C. Bayram, K.T. Shiu, Y. Zhu, C.W. Cheng, D.K. Sadana, Z. Vashaei, E. Cicek, R. McClintock and M. Razeghi SPIE Proceedings, Vol. 8631, p. 863112-1, Photonics West, San Francisco, CA-- February 4, 2013 Gallium Nitride (GaN) is a unique material system that has been heavily exploited for photonic devices thanks to ultraviolet-to-terahertz spectral tunability. However, without a cost effective approach, GaN technology is limited to laboratory demonstrations and niche applications. In this investigation, integration of GaN on Silicon (100) substrates is attempted to enable widespread application of GaN based optoelectronics. Controlled local epitaxy of wurtzite phase GaN on on-axis Si(100) substrates is demonstrated via metal organic chemical vapor deposition (MOCVD). CMOS-compatible fabrication scheme is used to realize [SiO2-Si{111}-Si{100}] groove structures on conventional 200-mm Si(100) substrates. MOCVD growth (surface treatment, nucleation, initiation) conditions are studied to achieve controlled GaN epitaxy on such grooved Si(100) substrates. Scanning electron microscopy and transmission electron microscopy techniques are used to determine uniformity and defectivity of the GaN. Our results show that aforementioned groove structures along with optimized MOCVD growth conditions can be used to achieve controlled local epitaxy of wurtzite phase GaN on on-axis Si(100) substrates. reprint   8.   Near milliwatt power AlGaN-based ultraviolet light emitting diodes based on lateral epitaxial overgrowth of AlN on Si(111) Y. Zhang, S. Gautier, C. Cho, E. Cicek, Z, Vashaei, R. McClintock, C. Bayram, Y. Bai and M. Razeghi Applied Physics Letters, Vol. 102, No. 1, p. 011106-1-- January 7, 2013 We report on the growth, fabrication, and device characterization of AlGaN-based thin-film ultraviolet (UV) (λ ∼ 359 nm) light emitting diodes (LEDs). First, AlN/Si(111) template is patterned. Then, a fully coalesced 7-μm-thick lateral epitaxial overgrowth (LEO) of AlN layer is realized on patterned AlN/Si(111) template followed by UV LED epi-regrowth. Metalorganic chemical vapor deposition is employed to optimize LEO AlN and UV LED epitaxy. Back-emission UV LEDs are fabricated and flip-chip bonded to AlN heat sinks followed by Si(111) substrate removal. A peak pulsed power and slope efficiency of ∼0.6 mW and ∼1.3 μW/mA are demonstrated from these thin-film UV LEDs, respectively. For comparison, top-emission UV LEDs are fabricated and back-emission LEDs are shown to extract 50% more light than top-emission ones. reprint   9.   Temperature dependence of the dark current and activation energy at avalanche onset of GaN Avalanche Photodiodes M.P. Ulmer, E. Cicek, R. McClintock, Z. Vashaei and M. Razeghi SPIE Proceedings, Vol. 8460, p. 84601G-1-- August 15, 2012 We report a study of the performance of an avalanche photodiode (APD) as a function of temperature from 564 K to 74 K. The dark current at avalanche onset decreases from 564 K to 74 K by approximately a factor of 125 and from 300 K to 74K the dark current at avalanche offset is reduced by a factor of about 10. The drop would have been considerably larger if the activation energy at avalanche onset (Ea) did not also decrease with decreasing temperature. These data give us insights into how to improve the single-photon counting performance of a GaN based ADP. reprint   10.   AlGaN-based deep-ultraviolet 320 x 256 focal plane array E. Cicek, Z. Vashaei, E.K. Huang, R. McClintock and M. Razeghi OSA Optics Letters, Vol. 37, No. 5, p. 896-898-- March 1, 2012 We report the synthesis, fabrication, and testing of a 320 × 256 focal plane array (FPA) of back-illuminated, solarblind, p-i-n, AlxGa1−xN–based detectors, fully realized within our research laboratory. We implemented a pulse atomic layer deposition technique for the metalorganic chemical vapor deposition growth of thick, high-quality, crack-free, high Al composition AlxGa1−xN layers. The FPA is hybridized to a matching ISC 9809 readout integrated circuit and operated in a SE-IR camera system. Solar-blind operation is observed throughout the array with peak detection occurring at wavelengths of 256 nm and lower, and falling off three orders of magnitude by ∼285 nm. By developing an opaque masking technology, the visible response of the ROIC is significantly reduced; thus the need for external filtering to achieve solar- and visible-blind operation is eliminated. This allows the FPA to achieve high external quantum efficiency (EQE); at 254 nm, average pixels showed unbiased peak responsivity of 75 mA∕W, which corresponds to an EQE of ∼37%. Finally, the uniformity of the FPA and imaging properties are investigated. reprint   11.   Deep ultraviolet (254 nm) focal plane array E. Cicek, Z. Vashaei, R. McClintock, and M. Razeghi SPIE Proceedings, Conference on Infrared Sensors, Devices and Applications; and Single Photon Imaging II, Vol. 8155, p. 81551O-1-- August 21, 2011 We report the synthesis, fabrication and testing of a 320 × 256 focal plane array (FPA) of back-illuminated, solarblind, p-i-n, AlxGa1-xN-based detectors, fully realized within our research laboratory. We implemented a novel pulsed atomic layer deposition technique for the metalorganic chemical vapor deposition (MOCVD) growth of crackfree, thick, and high Al composition AlxGa1-xN layers. Following the growth, the wafer was processed into a 320 × 256 array of 25 μm × 25 μm pixels on a 30 μm pixel-pitch and surrounding mini-arrays. A diagnostic mini-array was hybridized to a silicon fan-out chip to allow the study of electrical and optical characteristics of discrete pixels of the FPA. At a reverse bias of 1 V, an average photodetector exhibited a low dark current density of 1.12×10-8 A·cm-2. Solar-blind operation is observed throughout the array with peak detection occurring at wavelengths of 256 nm and lower and falling off three orders of magnitude by 285 nm. After indium bump deposition and dicing, the FPA is hybridized to a matching ISC 9809 readout integrated circuit (ROIC). By developing a novel masking technology, we significantly reduced the visible response of the ROIC and thus the need for external filtering to achieve solar- and visible-blind operation is eliminated. This allowed the FPA to achieve high external quantum efficiency (EQE): at 254 nm, average pixels showed unbiased peak responsivity of 75 mA/W, which corresponds to an EQE of ~37%. Finally, the uniformity of the FPA and imaging properties are investigated. reprint   12.   III-Nitride Optoelectronic Devices: From ultraviolet detectors and visible emitters towards terahertz intersubband devices M. Razeghi, C. Bayram, Z. Vashaei, E. Cicek and R. McClintock IEEE Photonics Society 23rd Annual Meeting, November 7-10, 2010, Denver, CO, Proceedings, p. 351-352-- January 20, 2011 III-nitride optoelectronic devices are discussed. Ultraviolet detectors and visible emitters towards terahertz intersubband devices are reported. Demonstration of single photon detection efficiencies of 33% in the ultraviolet regime, intersubband energy level as low as in the mid-infrared regime, and GaN-based resonant tunneling diodes with negative resistance of 67 Ω are demonstrated. reprint   13.   Comparison of ultraviolet APDs grown on free-standing GaN and sapphire substrates E. Cicek, Z. Vashaei, C. Bayram, R. McClintock, M. Razeghi and M. Ulmer Proceedings, Vol. 7780, p. 77801P, SPIE Optics and Photonics Symposium, Conference on Detectors and Imaging Devices: Infrared, Focal Plane and Single Photon, San Diego, CA -- August 4, 2010 There is a need for semiconductor-based ultraviolet photodetectors to support avalanche gain in order to realize better performance andmore effective compete with existing technologies. Wide bandgap III-Nitride semiconductors are the promising material system for the development of avalanche photodiodes (APDs) that could be a viable alternative to current bulky UV detectors such as photomultiplier tubes. In this paper, we review the current state-of-the-art in IIINitride visible-blind APDs, and present our latest results on GaN APDs grown on both conventional sapphire and low dislocation density free-standing c- and m-plane GaN substrates. Leakage current, gain, and single photon detection efficiency (SPDE) of these APDs were compared. The spectral response and Geiger-mode photon counting performance of UV APDs are studied under low photon fluxes, with single photon detection capabilities as much as 30% being demonstrated in smaller devices. Geiger-mode operation conditions are optimized for enhanced SPDE. reprint   14.   III-nitride based avalanche photo detectors R. McClintock, E. Cicek, Z. Vashaei, C. Bayram, M. Razeghi and M. Ulmer Proceedings, Vol. 7780, p. 77801B, SPIE Optics and Photonics Symposium, Conference on Detectors and Imaging Devices: Infrared, Focal Plane and Single Photon, San Diego, CA -- August 4, 2010 Research into III-Nitride based avalanche photodiodes (APDs) is motivated by the need for high sensitivity ultraviolet (UV) detectors in numerous civilian and military applications. By designing III-Nitride photodetectors that utilize low-noise impact ionization high internal gain can be realized-GaN APDs operating in Geiger mode can achieve gains exceeding 1×107. Thus with careful design, it becomes possible to count photons at the single photon level. In this paper we review the current state of the art in III-Nitride visible-blind APDs and discuss the critical design choices necessary to achieve high performance Geiger mode devices. Other major technical issues associated with the realization of visible-blind Geiger mode APDs are also discussed in detail and future prospects for improving upon the performance of these devices are outlined. The photon detection efficiency, dark count rate, and spectral response of or most recent Geiger-mode GaN APDs on free-standing GaN substrates are studied under low photon fluxes, with single photon detection capabilities being demonstrated. We also present our latest results regarding linear mode gain uniformity: the study of gain uniformity helps reveal the spatial origins of gain so that we can better understand the role of defects. reprint   15.   Geiger-mode operation of ultraviolet avalanche photodiodes grown on sapphire and free-standing GaN substrates E. Cicek, Z. Vashaei, R. McClintock, C. Bayram, and M. Razeghi Applied Physics Letters, Vol. 96, No. 26, p. 261107 (2010);-- June 28, 2010 GaN avalanche photodiodes (APDs) were grown on both conventional sapphire and low dislocation density free-standing (FS) c-plane GaN substrates. Leakage current, gain, and single photon detection efficiency (SPDE) of these APDs were compared. At a reverse-bias of 70 V, APDs grown on sapphire substrates exhibited a dark current density of 2.7×10−4 A/cm² whereas APDs grown on FS-GaN substrates had a significantly lower dark current density of 2.1×10−6 A/cm². Under linear-mode operation, APDs grown on FS-GaN achieved avalanche gain as high as 14 000. Geiger-mode operation conditions were studied for enhanced SPDE. Under front-illumination the 625 μm² area APD yielded a SPDE of 13% when grown on sapphire substrates compared to more than 24% when grown on FS-GaN. The SPDE of the same APD on sapphire substrate increased to 30% under back-illumination—the FS-GaN APDs were only tested under front illumination due to the thick absorbing GaN substrate. reprint   16.   GaN avalanche photodiodes grown on m-plane freestanding GaN substrate Z. Vashaei, E. Cicek, C. Bayram, R. McClintock and M. Razeghi Applied Physics Letters, Vol. 96, No. 20, p. 201908-1-- May 17, 2010 M-plane GaN avalanche p-i-n photodiodes on low dislocation density freestanding m-plane GaN substrates were realized using metal-organic chemical vapor deposition. High quality homoepitaxial m-plane GaN layers were developed; the root-mean-square surface roughness was less than 1 Å and the full-width-at-half-maximum value of the x-ray rocking curve for (1010) diffraction of m-plane GaN epilayer was 32 arcsec. High quality material led to a low reverse-bias dark current of 8.11 pA for 225 μm² mesa photodetectors prior to avalanche breakdown, with the maximum multiplication gain reaching about 8000. reprint   Page 1  (16 Items)

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