Center for Quantum Devices - Journal Articles and Conference Proceedings

Page 1 (9 Items)

1.	Advanced Monolithic Quantum Well Infrared Photodetector Focal Plane Array Integrated with Silicon Readout Integrated Circuit J. Jiang, S. Tsao, K. Mi, M. Razeghi, G.J. Brown, C. Jelen and M.Z. Tidrow Infrared Physics and Technology, 46 (3)-- January 1, 2005 Today, most infrared focal plane arrays (FPAs) utilize a hybrid scheme. To achieve higher device reliability and lower cost, monolithic FPAs with Si based readout integrated circuits (ROICs) are the trend of the future development. In this paper, two approaches for monolithic FPAs are proposed: double sided integration and selective epitaxy integration. For comparison, the fabrication process for hybrid quantum well infrared photodetectors (QWIP) FPAs are also described. Many problems, such as the growth of QWIPs on Si substrate and processing incompatibility between Si and III–V semiconductors, need to be solved before monolithic FPAs can be realized. Experimental work on GaInAs/InP QWIP-on-Si is given in this paper. A record high detectivity of 2.3×10⁹ jones was obtained for one QWIP-on-Si detector at 77 K. reprint
2.	Demonstration of a 256x256 Middle-Wavelength Infrared Focal Plane Array based on InGaAs/InGaP Quantum Dot Infrared Photodetectors (QDIPs) J. Jiang, K. Mi, S. Tsao, W. Zhang, H. Lim, T.O'Sullivan, T. Sills, M. Razeghi, G.J. Brown, and M.Z. Tidrow Applied Physics Letters, 84 (13)-- April 29, 2004 We report a demonstration of an infrared focal plane array based on InGaAs/InGaP quantum dot infrared photodetectors. The middle-wavelength infrared quantum-dot infrared photodetector (QDIP) structure was grown via low-pressure metal organic chemical vapor deposition. A detectivity of 3.6×10¹⁰ cm·Hz^½/W was achieved at T = 95 K and a bias of –1.4 V. The background limited temperature of our QDIP was 140 K with a 45° field of view. A 256×256 detector array was fabricated with dry etching, and hybridized to a Litton readout chip by indium bumps. Thermal imaging was achieved at temperatures up to 120 K. At T = 77 K, the noise equivalent temperature difference was measured as 0.509 K with a 300 K background and f/2.3 optics. reprint
3.	High Detectivity InGaAs/InGaP Quantum-Dot Infrared Photodetectors Grown by Low Pressure Metalorganic Chemical Vapor Deposition J. Jiang, S. Tsao, T. O'Sullivan, W. Zhang, H. Lim, T. Sills, K. Mi, M. Razeghi, G.J. Brown, and M.Z. Tidrow Applied Physics Letters, 84 (12)-- April 22, 2004 We report a high detectivity middle-wavelength infrared quantum dot infrared photodetector (QDIP). The InGaAs quantum dots were grown by self-assembly on an InGaP matrix via low pressure metalorganic chemical vapor deposition. Photoresponse was observed at temperatures above 200 K with a peak wavelength of 4.7 µm and cutoff wavelength of 5.2 µm. The background limited performance temperature was 140 K, and this was attributed to the super low dark current observed in this QDIP. A detectivity of 3.6×10¹⁰ cm·Hz^½/W, which is comparable to the state-of-the-art quantum well infrared photodetectors in a similar wavelength range, was obtained for this InGaAs/InGaP QDIP at both T = 77 K and T = 95 K at biases of –1.6 and –1.4 V, reprint
4.	Demonstration of a 256x256 Middle-Wavelength Infrared Focal Plane Array based on InGaAs/InGaP Quantum Dot Infrared Photodetectors (QDIPs) J. Jiang, K. Mi, S. Tsao, W. Zhang, H. Lim, T.O'Sullivan, T. Sills, M. Razeghi, G.J. Brown, and M.Z. Tidrow Virtual Journal of Nanoscale Science and Technology 9 (13)-- April 5, 2004reprint
5.	High Detectivity InGaAs/InGaP Quantum-Dot Infrared Photodetectors Grown by Low Pressure Metalorganic Chemical Vapor Deposition J. Jiang, S. Tsao, T. O'Sullivan, W. Zhang, H. Lim, T. Sills, K. Mi, M. Razeghi, G.J. Brown, and M.Z. Tidrow Virtual Journal of Nanoscale Science and Technology 9 (12)-- March 29, 2004reprint
6.	Fabrication of Indium Bumps for Hybrid Infrared Focal Plane Array Applications J. Jiang, S. Tsao, T. O'Sullivan, M. Razeghi, and G.J. Brown Infrared Physics and Technology, 45 (2)-- March 1, 2004 Hybrid infrared focal plane arrays (FPAs) have found many applications. In hybrid IR FPAs, FPA and Si read out integrated circuits (ROICs) are bonded together with indium bumps by flip-chip bonding. Taller and higher uniformity indium bumps are always being pursued in FPA fabrication. In this paper, two indium bump fabrication processes based on evaporation and electroplating techniques are developed. Issues related to each fabrication technique are addressed in detail. The evaporation technique is based on a unique positive lithography process. The electroplating method achieves taller indium bumps with a high aspect ratio by a unique “multi-stack” technique. This technique could potentially benefit the fabrication of multi-color FPAs. Finally, a proposed low-cost indium bump fabrication technique, the “bump transfer”, is given as a future technology for hybrid IR FPA fabrication. reprint
7.	Demonstration of 256x256 Focal Plane Arrays Based on Al-free GaInAs/InP QWIP J. Jiang, K. Mi, R. McClintock, M. Razeghi, G.J. Brown, and C. Jelen IEEE Photonics Technology Letters 15 (9)-- September 1, 2003 We report the first demonstration of an infrared focal plane array based on aluminum-free GaInAs-InP quantum-well infrared photodetectors (QWIPs).A unique positive lithography method was developed to perform indium-bump liftoff. The noise equivalent differential temperature (NEΔT) of 29 mK was achieved at 70 K with f/2 optics. reprint
8.	High Detectivity GaInAs/InP Quantum Well Infrared Photodetectors Grown on Si Substrates J. Jiang, C. Jelen, M. Razeghi and G.J. Brown IEEE Photonics Technology Letters 14 (3)-- March 1, 2002 In this letter, we report an improvement in the growth and the device performance of GaInAs-InP quantum well infrared photodetectors grown on Si substrates. Material growth techniques, like low-temperature nucleation layers and thick buffer layers were used to grow InP on Si. An in situ thermal cycle annealing technique was used to reduce the threading dislocation density in the InP-on-Si. Detector dark current was reduced 2 orders of magnitude by this method. Record high detectivity of 2.3 × 10⁹ cm·Hz^½·W^-1 was obtained for QWIP-on-Si detectors in the 7-9 μm range at 77 K reprint
9.	Growth and Optimization of GaInAsP/InP Material System for Quantum Well Infrared Photodetector Applications M. Erdtmann, J. Jiang, A. Matlis, A. Tahraoui, C. Jelen, M. Razeghi, and G. Brown SPIE Conference, San Jose, CA, -- January 26, 2000 Multi-quantum well structures of Ga_xIn_1-xAs_yP_1-y were grown by metalorganic chemical vapor deposition for the fabrication of quantum well IR photodetectors. The thickness and composition of the wells was determined by high-resolution x-ray diffraction and photoluminescence experiments. The intersubband absorption spectrum of the Ga_0.47In_0.53As/InP, Ga_0.38In_0.62As_0.80P_0.20 (1.55 μm)/InP, and Ga_0.27In_0.73As_0.57P_0.43 (1.3 μm))/InP quantum wells are found to have cutoff wavelengths of 9.3 μm, 10.7 micrometers , and 14.2 μm respectively. These wavelengths are consistent with a conduction band offset to bandgap ratio of approximately 0.32. Facet coupled illumination responsivity and detectivity are reported for each composition. reprint

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